Intel Ivy Bridge-E Power Density Revealed – Might Discourage Overclocking

Intel Ivy Bridge-E Power Density Revealed – Might Discourage Overclocking

Intel Ivy Bridge-E Power Density has just been revealed. Intel recently released pictures of the Wafers for Intel Ivy Bridge-E and a guy has calculated using GIMP and some futuristic algorithms,  the Power Density of Intel Ivy Bridge-E’s Power Density to be about 0.5W/mm² which is almost double of Sandy Bridge-E’s Power Density of 0.345W/mm².

Intel Ivy Bridge-E’s Increased Power Density Could Mean Less Overclocking

First lets see how the guy calculated Intel Ivy Bridge-E’s Power Density. Via Intel’s released pictures we can see that the news about Intel Ivy Bridge-E having an Actual 6 Core Die as opposed to a mutilated 8 core die are true. This gives rise to better ability to control the power consumption, cost and size of the chip. This is also essential in calculating the Intel Ivy Bridge-E Power Density.

Using some other critical data, we can theoretically calculate the Core Area using image pixels per square millimeter. Using the images it can be calculated that the Intel Ivy Bridge-E processor core area to be 258.37-259.84mm ² with an error percentage of 1%. Compare this to Sandy Bridge-E’s Core Area of 435mm² (with 8 cores).

Intel’s Ivy Bridge-E Power Density is higher then any other series, Sandy OR Ivy. Compare Intel Ivy Bridge-E’s Power Density of 0.5W/mm² to Ivy Bridge Power Density of 0.481W/mm², Sandy Bridge Power Density of 0.440W/mm², Sandy Bridge-E Power Density of 0.345W/mm² as Haswell’s Power Density of 0.475W/mm².

How Exactly would Intel Ivy Bridge-E Power Density Affect Overclocking?

Basically More Power Density would mean more heat dissipation per square mm. The More heat dissipation per square mm the less the overclocking capability because heat would increase exponentially with every increased clock. Thought it must be kept in mind that this is pure speculation,r the fact that Intel is going with Soldered heat dissipation method as opposed to a thermal paste solution is a clear indicator of a probable heat problem. Then again the Soldered method might just fix the increased heat dissipation per square mm.

This article originally appeared on WCCFTech (Link)