Intel Haswell-EP Xeon E5 V3 Processor Pictured – Only Compatible With LGA2011-3 Socket
Intel has just launched their Ivy Bridge-EX Xeon E7 V2 lineup for high-performance servers and are now aiming to prepare their next generation of Haswell-EP processors. The Haswell-EP Xeon E5 V3 processors would launch the current year featuring new enhancements and feature the 22nm Haswell microarchitecture.
Intel Next-Gen Haswell-EP Xeon E5 V3 Processor Pictured
Intel is planning to introduce their third LGA2011 socket type known as the LGA2011-3 which will debut along with the Haswell-E and Haswell-EP generation of microprocessor families. This has been known since a while and the socket change was expected considering the new features such as DDR4 memory supported by the platform. The source also managed to take some comparison pictures of the Haswell-EP processor with Ivy Bridge-EX, Ivy Bridge-EP and Sandy Bridge-EP and gathered some interesting details:
A few quick details pop out. At first glance just looking at the four edges of the Sandy Bridge-EP and Ivy Bridge-EP chips one can see different contact pad alignment than the more full edges around Ivy Bridge-EX and Haswell-EP. At first glance Ivy Bridge-EX and Haswell-EP look like they have similar contact pad alignment. If you look along the bottom right edge you can see between the corner and the notch there are four contact pads on Ivy Bridge-EX. Looking at Haswell-EP there appear to be six. via ServerTheHome
Intel Haswell-EP Xeon E5-2600 v3 – Haswell Arrives on Xeon Processors
Image courtesy of VR-Zone!
The new Haswell architecture would further leverage the performance over the existing Ivy Bridge architecture based Xeon family delivering more performance with improved efficiency which is the key role of effectiveness in the enterprise and workstation scape. Just like Ivy Bridge-EP before it, we will get multiple die variants of Xeon E5 2600 v3 family which will only be detailed once they launch next year.
Haswell-EP will be Intel’s first native platform to feature DDR4 memory support with speeds of 2133 MHz which will provide significant boost in bandwidth when compared to conventional DDR3-1866 MHz memory. Intel will also topple these chips with 40 PCI-Express Gen 3 lanes and we are looking at TDPs ranging between 70W to 145 Watts while the high-performance workstation parts will feature a TDP of 160W.
Intel Broadwell-EP Xeon E5-2600 v4 – The First 14nm Xeon Processors
Following Haswell-EP is Broadwell-EP, Intel next-generation and first 14nm based Xeon processor series featuring their upcoming Broadwell architecture. Broadwell which according to Intel’s Tick-Tock roadmap is a Tick which means its essentially a die shrink (14nm) of Haswell featuring massive changes to the core design.First of all, the Xeon E5-2600 V4 flagship processor would feature upto 18 cores and 36 threads on a single socket. That’s 72 threads running simultaneously on a dual socket enterprise setup and from the performance uplift chart , you can note that its going to be a complete and powerful package. Broadwell-EP will also be coupled with 45 MB of Cache (LLC) and will natively support DDR4-2400 MHz memory which is a decent upgrade over Haswell-EP but that puts the total improvement over DDR3 to about 25 percent which is great. TDPs are expected to remain the same as Haswell-EP for each part but take it as an improvement since a Broadwell-EP with 18 cores would be featuring a 160W TDP which is the same as a 14 Core Haswell-EP variant.
On the clock frequency side, we aren’t looking at the 18 or 14 core chips to be clocked high from 3 to 3.3 GHz but the 10-12 core variants have the probability of featuring speeds as high as 4 GHz with lower TDPs.
Intel Ivy Bridge-EP | Intel Haswell-EP | Intel Broadwell-EP | |
Series | Xeon E5-2600 v2 | Xeon E5-2600 v3 | Xeon E5-2600 v4 |
Max Cores | 12 | 14 | 18 |
Threads | 24 | 28 | 36 |
LLC Cache | 30 MB L3 | 35 MB L3 | 45 MB L3 |
Memory | DDR3-1866 | DDR4-2133 | DDR4-2400 |
Memory Population | Quad Channel DDR3 | Quad Channel DDR4 (3 LRDIMM) | Quad Channel DDR4 (3DS LRDIMM) |
Chipset | C610 ‘Wellsburg’ | C610 ‘Wellsburg’ | C610 ‘Wellsburg’ |
TDP | 130W | 145W (160W Workstation Only) | 145W (160W Workstation Only) |
Launch | IDF 2013 | IDF 2014? | IDF 2015? |
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